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A repetitive-pulse TVS diode cannot be approved from a single IPP value. Pulse width, interval, ambient temperature and board thermal path must remain in the same verification record.
Direct answer
Measure pulse current, width, repetition and duration on the application. Compare them with the stated VC and IPP conditions, then check temperature, leakage and function over the required operating cycle.
Capture the pulse from the application
Relay turn-off, switching loads, hot-plug events and cable coupling do not have the same source impedance or duration. A peak-voltage label alone is insufficient for a repeated-stress decision.
| Review item | Condition to record | Why it matters |
|---|---|---|
| Pulse current | Peak, direction and bandwidth | VC is current dependent |
| Pulse width | Rise time, duration and waveform | Waveforms are not interchangeable |
| Repetition | Events per second and run duration | Repeated events add thermal stress |
| Board state | Ambient, copper and nearby heat | Temperature changes leakage and margin |
Check thermal and electrical drift on the board
A repeated-stress check should compare before-and-after leakage, terminal waveforms and functional status while the target cycle is running. A single successful event is not the full verification.
Keep IPP and VC with their stated test conditions.
Separate board-generated switching pulses from external surge conditions.
Do not use one pass/fail observation as a long-cycle conclusion.
Board verification sequence
Define the worst supply, load and switching rate.
Measure the TVS terminals, protected node and pulse current.
Run the selected cycle and compare leakage, waveform and function.
Record the complete part number, board, thermal condition and instrument setup.
FAQ
Does a higher IPP always suit repetitive pulses?
No. IPP is tied to a stated waveform and single-event condition. Repetition and thermal conditions need a separate check.
Is a short-circuit check enough after repeated pulses?
No. Leakage, dynamic clamping, temperature and system function can also change.
Sources
Source check date: 2026-10-15. Use the complete part number, document revision, board revision, stated test conditions and board-level verification record together.
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